Category Specification Brand Thermal Grizzly Product Name Kryonaut Thermal Paste Model / Part No. TG-K-100-R Type Premium Performance Thermal Compound Net Weight 37 grams Thermal Conductivity ~12.5 W/m·K Thermal Resistance Ultra-low Operating Temp Range –250 °C to +350 °C Viscosity Medium-high (easy application) Color Gray Electrical Conductivity Non-conductive (safe for electronics) Recommended Use CPUs, GPUs, heatsinks on high-performance systems Curing / Burn-in Not required Longevity Long-lasting under heavy loads Application Style Syringe with precision tip
Category Specification Brand Thermal Grizzly Product Name Kryonaut Extreme Thermal Paste Model / Part No. TG-KE-002-R Type Premium Extreme Thermal Compound Net Weight 2 g Thermal Conductivity ~14.2 W/m·K (very high) Thermal Resistance Ultra-low Operating Temp Range –250 °C to +350 °C Viscosity Medium-high Color Dark gray Electrical Conductivity Non-conductive (safe for electronics) Recommended Use High-end CPUs, GPUs, overclocked systems Curing / Burn-in Not required Longevity Long-lasting under sustained load Application Style Syringe with precision tip
Category Specification Brand Thermal Grizzly Product Name Kryonaut Model / Part No. TG-K-001-RS Type Premium Thermal Paste Net Weight 1 gram Thermal Conductivity ~12.5 W/m·K Thermal Resistance Very low Operating Temp Range –250 °C to +350 °C Viscosity Medium-high (easy application) Color Gray Electrical Conductivity Non-conductive Recommended Use CPUs, GPUs, high-performance cooling Curing / Burn-in Not required Longevity Long-lasting under heavy loads Included Syringe with paste
Category Specification Brand Thermal Grizzly Model Carbonaut Part Number TG-CA-32-32-02-R Type Thermal Pad Material High-performance carbon-based thermal pad Thickness 0.5 mm (typical standard) Thermal Conductivity ~17 W/m·K (very high for a pad) Operating Temperature –40 °C to +220 °C Hardness Medium-firm Electrical Conductivity Insulating (non-conductive) Reusability Yes (pads can be re-applied if cleaned) Ideal Use VRAM/VRM cooling, heat sink bridging, component thermal bridging Included Quantity 1 sheet / multiple pieces (varies by packaging) Form Factor Sheet / cuttable pad Compatibility GPUs, CPUs (secondary cooling), PSUs, power components
The Thermal Grizzly Minus Pad 8 (TG-MP8-120-20-15-1R) is a high-performance, 120 x 20 x 1.5 mm pink thermal pad featuring 8.0 W/mK conductivity. It is highly elastic, electrically insulating, and designed for efficient heat transfer in applications like GPU VRMs, memory, and M.2 SSDs.
The Thermal Grizzly Minus Pad 8 (TG-MP8-30-30-05-1R) is a high-performance 30x30x0.5 mm thermal pad with an 8.0 W/mK conductivity rating. It is highly elastic, electrically insulating, and operates between -100°C and +250°C, making it ideal for compensating component gaps in electronics
Specification Details Net Weight 4 g Thermal Conductivity Higher than MX-4, optimized for modern CPUs and GPUs Thermal Resistance Extremely low, designed for efficient heat transfer Viscosity Around 45,000 poise Density 2.6 g/cm³ Operating Temperature Range −50 °C to +150 °C Volume Resistivity 1.8 × 10¹² Ω·cm Breakdown Voltage 7.5 kV/mm Color / Type Grey, high-viscosity non-curing paste Electrical Conductivity Non-conductive and non-capacitive Compatibility Works with CPUs, GPUs, and console chips Application Small central dot or thin even layer recommended Durability Long-lasting, prevents dry-out and pump-out effect
Specification Details Net Weight 2 g Thermal Conductivity 12.8 W/m·K Thermal Impedance < 0.01 °C·cm²/W Specific Gravity (25 °C) 2.8 g/cm³ Operating Temperature Range −150 °C to +250 °C Color / Type Grey non-curing compound Electrical Conductivity Non-conductive, safe for CPUs and GPUs Compatibility Suitable for CPU and GPU applications Application Thin, even layer for optimal thermal contact Use Case High-performance, overclocked, and gaming systems
Specification Details Net Weight 5 g Thermal Conductivity 6.5 W/m·K Thermal Impedance 0.08 °C·cm²/W Specific Gravity (25 °C) 2.9 g/cm³ Operating Temperature Range −50 °C to +200 °C Color / Type Blue-grey non-curing paste Electrical Conductivity Non-conductive, safe for CPUs and GPUs Compatibility Suitable for CPU and GPU thermal interfaces Application Apply a thin, even layer for optimal contact Use Case High-performance builds, overclocking, quiet cooling setups
Specification Details Net Weight 2 g Thermal Conductivity Approximately 4.5 – 5.5 W/m·K Operating Temperature Range −50 °C to +240 °C Color / Type Grey paste (non-curing compound) Electrical Conductivity Non-conductive, safe for CPUs and GPUs Compatibility Suitable for CPU and GPU heatsinks Application Standard “pea” or thin-spread method recommended Durability Long-lasting formula resistant to drying or cracking Viscosity Balanced for smooth application and stable spread Storage Life Up to 3 years (sealed)