The Thermal Grizzly Minus Pad 8 (TG-MP8-30-30-05-1R) is a high-performance 30x30x0.5 mm thermal pad with an 8.0 W/mK conductivity rating. It is highly elastic, electrically insulating, and operates between -100°C and +250°C, making it ideal for compensating component gaps in electronics
Category Specification Brand Thermal Grizzly Product Name Kryonaut Thermal Paste Model / Part No. TG-K-100-R Type Premium Performance Thermal Compound Net Weight 37 grams Thermal Conductivity ~12.5 W/m·K Thermal Resistance Ultra-low Operating Temp Range –250 °C to +350 °C Viscosity Medium-high (easy application) Color Gray Electrical Conductivity Non-conductive (safe for electronics) Recommended Use CPUs, GPUs, heatsinks on high-performance systems Curing / Burn-in Not required Longevity Long-lasting under heavy loads Application Style Syringe with precision tip
Category Specification Brand Thermal Grizzly Product Name Kryonaut Extreme Thermal Paste Model / Part No. TG-KE-002-R Type Premium Extreme Thermal Compound Net Weight 2 g Thermal Conductivity ~14.2 W/m·K (very high) Thermal Resistance Ultra-low Operating Temp Range –250 °C to +350 °C Viscosity Medium-high Color Dark gray Electrical Conductivity Non-conductive (safe for electronics) Recommended Use High-end CPUs, GPUs, overclocked systems Curing / Burn-in Not required Longevity Long-lasting under sustained load Application Style Syringe with precision tip
Category Specification Brand Thermal Grizzly Product Name Kryonaut Model / Part No. TG-K-001-RS Type Premium Thermal Paste Net Weight 1 gram Thermal Conductivity ~12.5 W/m·K Thermal Resistance Very low Operating Temp Range –250 °C to +350 °C Viscosity Medium-high (easy application) Color Gray Electrical Conductivity Non-conductive Recommended Use CPUs, GPUs, high-performance cooling Curing / Burn-in Not required Longevity Long-lasting under heavy loads Included Syringe with paste
Category Specification Brand Thermal Grizzly Model Carbonaut Part Number TG-CA-32-32-02-R Type Thermal Pad Material High-performance carbon-based thermal pad Thickness 0.5 mm (typical standard) Thermal Conductivity ~17 W/m·K (very high for a pad) Operating Temperature –40 °C to +220 °C Hardness Medium-firm Electrical Conductivity Insulating (non-conductive) Reusability Yes (pads can be re-applied if cleaned) Ideal Use VRAM/VRM cooling, heat sink bridging, component thermal bridging Included Quantity 1 sheet / multiple pieces (varies by packaging) Form Factor Sheet / cuttable pad Compatibility GPUs, CPUs (secondary cooling), PSUs, power components
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